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Shenzhen AiLeiDi Technology Co. Ltd ATT: Binlong ChenADD: Rm 8016, TaoJing Building, Minbao Road, Minzhi, LongHua District, Shenzhen City, Guangdong...Contact Now
CREE XPG2 HIGH POWER CERAMIC LED CHIP

CREE XPG2 HIGH POWER CERAMIC LED CHIP

  • CREE XPG2 HIGH POWER CERAMIC LED CHIP
  • Size 3.45 x 3.45 mm
  • Maximum Drive Current 1.5 A
  • Maximum Power 4.9 W
  • Maximum Light Output 515 lm @ 4.7 W (85°C)
  • Typical Forward Voltage 2.8 V @ 0.35 A
  • Viewing Angle 115 °
  • Binning 85°C
  • ANSI
  • Thermal Resistance 4 °C/W
  • Reflow Solderable Yes - JEDEC J-STD-020C-compatible
  • RoHS-Compliant Yes
  • REACH-Compliant Yes
  • UL-Recognized Yes - Level 4 Enclosure Consideration
  • Package Size 3.45 x 3.45 mm
CREE XPG2 HIGH POWER CERAMIC LED CHIP

XLamp XP-G2

Delivering high performance and lower system cost to XP-based designs

Built on the SC³ Technology Platform, the XLamp XP-G2 LED delivers up to 20% more lumens per watt and 2.5 times the lumens-per-dollar over the original XP-G, lowering system cost up to 57%. The new XP-G2 is optically compatible with the original XP-G – providing drop-in-ready performance enhancements to shorten the LED fixture design cycle and improve time to market. Combining high light output, reliability and efficacy, XP-G2 is optimized for directional, high-lumen applications, from indoor and outdoor to portable and lamp retrofits. 


CRI Color Temperature (K)
Warm White
2700 – 3750
Outdoor White
3500 – 5300, 
Neutral White
3700 – 5000
Cool White
5000 – 8300
No Min  
Min 70
Typ 75  
Min 80  
Typ 80  


Shenzhen AiLeiDi Technology Co. Ltd

Tel:0086-13590456396

Contact Person:Mr. Chen

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