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Shenzhen AiLeiDi Technology Co. Ltd ATT: Binlong ChenADD: Rm 8016, TaoJing Building, Minbao Road, Minzhi, LongHua District, Shenzhen City, Guangdong...Contact Now
CREE XLamp XHP50 High Power Ceramic LED Chip

CREE XLamp XHP50 High Power Ceramic LED Chip

  • CREE XLamp XHP50 High Power Ceramic LED Chip
  • Size 5 x 5 mm
  • Product Options 6 V 
  • 12 V 
  • High-CRI
  • Maximum Drive Current 3 A (6 V)
  • 1.5 A (12 V)
  • Maximum Power 19 W
  • Maximum Light Output 2546 lm @ 19 W
  • Typical Forward Voltage 5.75 V White @ 1400 mA (6 V)
  • 11.5 V White @ 700 mA (12 V)
  • Viewing Angle 120 °
  • Binning 85°C
  • ANSI (White)
  • 2- 3- and 5-Step EasyWhite®
  • Thermal Resistance 1.2 °C/W
  • Reflow Solderable Yes - JEDEC J-STD-020C-compatible
  • REACH-Compliant Yes
  • RoHS-Compliant Yes
  • UL-Recognized Yes - Level 4 Enclosure Consideration
CREE XLamp XHP50 High Power Ceramic LED Chip

XLamp XHP50

Redefining Performance to Radically Lower System Cost

Powered by Cree’s groundbreaking SC5 Technology™ Platform, the XLamp XHP50 LED is a member of Cree’s Extreme High Power (XHP) class of LEDs that redefines lumen density and reliability to radically reduce system costs by up to 40 percent. At its maximum current, the XHP50 LED delivers twice the light output of the industry’s brightest single-die LED, the XLamp XM-L2 LED, at a similar lumens per watt and without increasing the package footprint. The XHP50 LED also achieves longer lifetime at higher operating temperatures. The overall result is significantly lower thermal, mechanical and optical costs at the system level.

CRI Color Temperature (K)
Warm White
2600 – 3700
Neutral White
3700 – 5000
Cool White
5000 – 8300
Standard
Min 80
Min 85
Min 90


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