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Shenzhen AiLeiDi Technology Co. Ltd ATT: Binlong ChenADD: Rm 8016, TaoJing Building, Minbao Road, Minzhi, LongHua District, Shenzhen City, Guangdong...Contact Now
CREE XLAMP XHP35 High Power Ceramic LED Chip

CREE XLAMP XHP35 High Power Ceramic LED Chip

  • CREE XLAMP XHP35 High Power Ceramic LED Chip
  • Size 3.45 x 3.45 mm
  • Product Options High-CRI
  • Maximum Drive Current 1.05 A
  • Maximum Power 13 W
  • Maximum Light Output 1833 lm @ 13 W
  • Typical Forward Voltage 11.3 V @ 350 mA
  • Viewing Angle 120 °
  • Binning 85°C
  • ANSI (White)
  • 3- and 5-Step EasyWhite®
  • Thermal Resistance 1.8 °C/W
  • Reflow Solderable Yes - JEDEC J-STD-020C-compatible
  • REACH-Compliant Yes
  • RoHS-Compliant Yes
CREE XLAMP XHP35 High Power Ceramic LED Chip

XLamp XHP35

Redefining Performance to Radically Lower System Cost

The XLamp® XHP35 LED brings the performance of Cree’s Extreme High Power LEDs to the XP footprint, setting a new standard for the 3.5-mm footprint to deliver the highest-performing XP LED. Leveraging the industry’s breakthrough 12-V monolithic power die, uniquely enabled by Cree’s SC5 Technology™ Platform, the XHP35 LED allows the use of readily available, cost-optimized drivers to unleash the capabilities of Cree’s high-power LEDs. Delivering 50% higher performance than Cree’s previous highest-performing single-die LED, the XHP35 LED is application optimized to enable new designs and radically lower system costs.

CRI Color Temperature (K)
Warm White
2700 – 3500
Neutral White
4000 – 5000
Cool White
5700 – 7000
No Min
Min 70
Min 80
Min 90


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