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Bridgelux LED Chip: BXFD4545

Bridgelux LED Chip: BXFD4545

  • BXCD4545XXX-YY-Z (45mil x 45mil or 1.14 X 1.14 mm) Data Sheet DS-C15
  • BXCD4040 (40mil x 40mil or 1.02mm x 1.02mm) Datasheet DS-C26
  • BXCD3333XXX-YY-Z (33mil x 33mil or 0.84 X 0.84 mm) Data Sheet DS-C17
  • BXCE4545XXX-YY-Z (45mil x 45mil or 1.14 x 1.14 mm) Data Sheet DS-C10
  • BXFE4545XXX-YY-Z (45mil x 45mil or 1.14 x 1.14 mm) Data Sheet DS-C18
  • BXFD4545 (45mil x 45mil or 1.14mm x 1.14mm) Datasheet DS-C21
  • BXTA4545 (45mil-x 45mil or 1.14mm x 1.14mm) Datasheet DS-C20
  • BXCD2345 (23mil x 45 mil or 0.64mm x 1.14mm) Datasheet DS-C25
BRIDGELUX LED Chip. LED DIE
Bridgelux manufacture leading-edge, high-power light emitting diode (LED) chips. Our blue LED chips are packaged into components such as LED emitters and chip-on-board arrays (COBs). Bridgelux chips are the basis for LED luminaires including, signage, automotive applications, and camera flash for mobile appliances. 

BRIDGELUX produce LED chips using both GaN-on-Sapphire and the new GaN-on-Silicon (GaN-on-Si) technology. GaN-on-Si is potentially the most substantial cost-savings opportunity in the history of the LED industry. Its approximate reductions relative to traditional LED technologies are: 
50% at the chip level, using 8” wafers and proven semiconductor manufacturing methods;
20 to 40% using traditional package-level technology; and
4 to 5x further reduction using fundamentally new package architecture.
Long term, GaN-on-Si extends cost benefits to the entire lighting system by using advanced semiconductor processes to rapidly consolidate other lighting components, such as power and control integrated circuits.
We are the first company to offer commercial GaN-on-Si LED chips with volume production, and we started shipping GaN-on-Si based products commercially in 2014.

Shenzhen AiLeiDi Technology Co. Ltd

Tel:0086-13590456396

Contact Person:Mr. Chen

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